IBM 46D1407 X3500 HEAT SINK M2/M3

$50.15 (Ex. GST)

In stock: 1

IBM 46D1407 X3500 HEAT SINK M2/M3

• Passive aluminum fin-stack heatsink with integrated heat spreader
• LGA1366 socket compatibility (Intel Xeon 5500/5600 series)
• Latch-type mounting mechanism for secure CPU contact
• Pre-applied or included thermal interface material (TIM)
• Optimized for IBM System x chassis airflow (front-to-back)
• Supports single- and dual-processor configurations
• Low-profile design for 2U/4U rack/tower servers

Model / Part Number: IBM 46D1407 (cross-ref: 44X1745)
Interface / Connector Type: LGA1366 direct-mount CPU heatsink with latch mechanism
Capacity / Speed / Frequency: Thermal dissipation for Xeon 5500/5600 series / Passive cooling
Form Factor: Low-profile heatsink for 2U/4U IBM System x servers
Spindle Speed (RPM): N/A (Passive heatsink)
Sector Format / Firmware Info: N/A (Hardware cooling component)
Power Requirements: N/A (Passive; relies on chassis/system airflow)

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